Unlock the next chapter,from "Round" to "Square" Kzone actively deploy its presence in the field of glass-based panel-level advanced packaging. Relying on key technologies such as FOPLP, TGV, and RDL, it arranges chips on square substrates, replacing round wafers with square ones to significantly improve area utilization and create better cost-effectiveness.
To achieve this technological, Kzone is equipped with advanced equipment covering the entire process line, mainly including: ECP, Laser-induced TGV etcher, vertical wet processing equipment, horizontal wet processing equipment, and slit coater. These key devices constitute Kzone’s full-process manufacturing capabilities in glass-based packaging — from patterning, via formation, metallization to coating treatment.