It is designed for high-precision photoresist coating on the surface of glass substrates, integrating multi-functional units including homogenization, pre-baking and cooling. It features excellent coating uniformity and precise thickness control, supports the processing of large-size substrates, and is suitable for high-resolution lithography and micro-nano structure fabrication.
Specification
Item | Parameters |
| Technical specifications | Coating die height positioning accuracy: 1 μm Straightness accuracy: ±2 μm Air flotation accuracy: ±2 μm (coating line) |
| Coating Film Layer | Film thickness uniformity: 3% Film thickness: adjustable at 1.2/1.5/1.8/2.2 μm |
| Coating die | Ultra-hard alloy (optional) Slit die lip straightness: 3 μm/m |
| Coating pump | Koganei |
| Data Visualization | Automatic collection of coating pressure curves, displayed on the main control computer |
FPD
PV
Semiconductor