Applicable substrate size

·  500*515mm, downward compatible, including round and square wafers.

  Applicable substrate thickness

·  0.2-1.5mm

  Process capacity

·  Process flow: laser → etching → hot water rinsing → acid pickling → water rinsing → drying

·  Process temperature: 80-170°C (accuracy ±0.5°C@110°C)

·  Alkali concentration: 10-70%

·  TGV diameter: 15-200μm (uniformity ±0.5μm@50μm)