Applicable substrate size

·  500*515mm, downward compatible

  Applicable substrate thickness

·  0.2-1.5mm

  Process capacity

·  Applicable processes: development, etching, stripping, cleaning

·  Developing L/S: 5/5μm and above

·  Special clamping method, suitable for thin or brittle materials, such as glass substrates and ceramic substrates for processing

·  Pressure uniformity ≥ 95%; compatible with two-fluid jet processing

·  Cleaning rate > 99% for particles larger than 1μm