Leading Wet-Process Technologies

FPD Industry

·Driven by terminal applications such as TV panel, smartphone display, tablet display, wearable display the FPD industry has entered a rapid growth channel and become an important industry driving China's economic development.

·Kzone is the first Chinese supplier of wet process equipment in the field of FPD and the only Chinese supplier of a full range of wet process equipment for main processes in the field of FPD. It has successively completed independent R&D on a full range of wet process equipment from G2.5 to G10.5, including cleaner, coater, developer, etcher, photoresist stripper and mask cleaner.

Technology strategy with two main lines

·Copper interconnect technology: Develop copper grid linemetallization equipment for BC cells, replacing silver pastesolutions and reducing material costs by 70%.

·Perovskite technology extension: Provide slit coater to support large-area uniform preparation of perovskite light-absorbing layers(material utilization rate > 90%).

TOPCon technology breakthrough

·First Chinese produced lGW complete line equipment:Integrated chain-type single-sided etching (5.0++ meters/min)+ six-cassette alkaline polishing & RCA cleaning;

·Capacity:>18,000 wafers/hour (182mm silicon wafers).

Semiconductor Industry

Unlock the next chapter,from "Round" to "Square" Kzone actively deploy its presence in the field of glass-based panel-level advanced packaging. Relying on key technologies such as FOPLP, TGV, and RDL, it arranges chips on square substrates, replacing round wafers with square ones to significantly improve area utilization and create better cost-effectiveness.

To achieve this technological, Kzone is equipped with advanced equipment covering the entire process line, mainly including: ECP, Laser-induced TGV etcher, vertical wet processing equipment, horizontal wet processing equipment, and slit coater. These key devices constitute Kzone’s full-process manufacturing capabilities in glass-based packaging — from patterning, via formation, metallization to coating treatment.