Applicable substrate size

  500*515mm (glass substrate, ceramic substrate, IC substrate, etc.)

  Applicable substrate thickness

  0.2-1.5 mm

  Process capacity

  Process flow: (pre-cleaning) → pre-wetting → electroplating → cleaning → drying

  Pre-wetting: compatible with vacuum pre-wetting and ordinary pre-wetting

  Anode: compatible with soluble and insoluble anodes, zoned anodes

  Power supply: DC power supply or pulse power supply is provided according to process requirements

  Uniformity：＜7%

  Aspect ratio: ≤ 10:1 @ diameter 50μm