As the semiconductor industry moves toward higher integration and heterogeneous integration, advanced packaging is becoming essential for improving chip performance and reducing package size. Glass substrate packaging is gaining attention for its electrical properties and cost potential, with through-glass vias (TGV) and high-density redistribution layers (RDL) playing key roles.
Electrochemical plating (ECP) is critical to reliable TGV filling and precise RDL fabrication. Plating quality directly affects electrical performance, reliability, and yield. To address challenges such as high-aspect-ratio via filling and large-area plating uniformity, Kzone provides reliable electroplating solutions for panel-level advanced packaging.
Kzone electroplating equipment is designed for advanced semiconductor packaging, with optimized processes to meet the specific requirements of glass substrates and other emerging packaging materials.
Featuring a tank design optimized through electric-field and fluid-flow simulations, the equipment achieves 7% plating uniformity based on 64-point measurements. This helps ensure consistent copper deposition across large-area substrates.
Designed for demanding interconnect structures, the equipment supports aspect ratios of 10:1 and above and has demonstrated successful filling of 10:1 TGV structures, meeting the requirements of high-density vertical interconnects.
The equipment supports multiple electroplating applications in advanced packaging, including through-glass via (TGV) filling, deep blind via filling, bump plating and redistribution layer (RDL) plating.
The fully automated system features precision robotic handling and material transfer mechanisms designed to reduce breakage when processing fragile substrates such as glass. This helps improve production yield, process stability, and manufacturing efficiency.
As advanced packaging drives greater system integration, glass substrates are emerging as an important technology direction. With high plating uniformity, reliable via-filling performance, and automated substrate protection, Kzone electroplating equipment addresses key metallization challenges in advanced packaging.
As a key solution for TGV and RDL process lines, Kzone aims to help semiconductor packaging and testing companies, advanced display manufacturers, and end-product manufacturers overcome high-density interconnect challenges and capture new opportunities in advanced packaging.
Suzhou Kzone Equipment Technology Co., Ltd. is an advanced manufacturing company specializing in process development, equipment design, manufacturing, sales, and after-sales service. Kzone provides advanced wet-process equipment and process solutions for flat panel displays, photovoltaics, and semiconductors.
Its product portfolio includes high-precision cleaning, coating, developing, etching, and stripping equipment, as well as supporting technologies such as online waste-liquid recovery, intelligent integration, and data analytics.
