As the surge in AI computing power and the demand for high-frequency communication reshape the semiconductor industry, traditional packaging technologies are increasingly hitting bottlenecks: organic substrates suffer from high dielectric loss and susceptibility to warpage, while Through-Silicon Via (TSV) technology entails high costs and complex processes, making it difficult to meet the interconnection requirements of high-end chips. Thanks to their inherent properties—such as low thermal expansion and low signal loss—glass substrates have emerged as a key frontier in advanced packaging, with Through-Glass Via (TGV) technology serving as the pivotal driver of this transformation. As the only domestic advanced manufacturing enterprise capable of supplying a full suite of wet-process equipment for large-format glass panels, Suzhou Kzone Equipment has achieved a breakthrough through technological self-reliance. The company has established China’s first open platform for TGV glass substrate validation services, providing end-to-end support for the industry—spanning everything from R&D validation to mass production.
Leveraging its long-standing expertise in the process technology, equipment development, and industrialization of large-format glass panels, KZone focuses on advanced glass-substrate-level packaging. The company is dedicated to overcoming technical bottlenecks in TGV (Through-Glass Via) technology and establishing a fully autonomous, controllable ecosystem spanning the entire "equipment-process-application" chain. With the completion of China’s first open validation platform for a complete TGV production line, KZone provides comprehensive, one-stop R&D and testing support, building a solid bridge for upstream and downstream clients to transition from laboratory development to mass production.
Utilizes a combined "laser-induced modification + wet etching" process featuring high-temperature alkaline etching, offering excellent temperature control, circulation performance, and uniformity. The vertical basket-style process design enables high throughput, meeting the demands of large-scale panel-level packaging production and helping to reduce manufacturing costs.
Via formation capabilities: Through-via diameter of 15–200 μm (uniformity ±0.5 μm at 50 μm); circularity U% ≤ 5%; uniformity U% ≤ 5%; compatible with glass thicknesses of 0.1 mm–1.1 mm.
Utilizes double-sided electrochemical deposition equipment compatible with both soluble and insoluble anode designs; employs DC and pulse plating processes; supports processing of thin substrates (0.3–1.5 mm); plating uniformity <7%; aspect ratio ≤10:1 (at 50 μm diameter).
An innovative air-float coating system is employed to prevent damage from physical contact; the vertical developing equipment utilizes a specialized clamping process suitable for thin or brittle materials, achieving a developing resolution of 5/5 μm (L/S).
Within KZone Semiconductor’s comprehensive TGV (Through-Glass Via) process system, wet processing serves as a core element spanning the entire workflow—from pre-treatment and via formation to patterning, metallization, and post-treatment. Leveraging its deep expertise in high-end wet processing equipment, KZone delivers high-precision, highly consistent wet processing solutions for advanced glass-substrate-level packaging.
KZone’s TGV pilot line platform serves not only as a "proving ground" for technology R&D but also as an "incubator" for industrialization. It offers one-stop services to advanced packaging companies, research institutes, and universities, catering to high-end demands across multiple sectors.
Customized TGV process development, parameter optimization, and yield enhancement solutions to help partners rapidly overcome technical bottlenecks;
Small-batch manufacturing of TGV glass substrates and packaging samples to quickly validate design feasibility and shorten the industrialization cycle;
Customization of full-process TGV wet processing equipment tailored to client needs, supported by comprehensive after-sales technical assistance.
Established in 2011 in Changshu, Jiangsu, Suzhou Kzone Equipment Technology Co., Ltd. is a high-tech enterprise specializing in the development of wet processing and patterning technologies and equipment. The company is dedicated to providing high-precision wet processing and patterning equipment—including systems for cleaning, coating, developing, etching, photoresist stripping, and electrochemical deposition—to the advanced display, photovoltaic, and semiconductor industries. Additionally, the company offers innovative solutions such as online waste liquid recycling systems, intelligent integration, and data analysis, helping customers achieve green and intelligent upgrades in their production processes.
