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晶洲装备从G2.5到G6及以上尺寸掩膜版清洗机设备的自主研发研发 Mask Cleaner

Processes: The processes of production, cleaning and check for each mask during its preparation before steam plating
QTY of units: Demand only from factory of AMOLED 30K ≥ 6 units/set

  • Mask Cleaner




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High-precision and stable transmition

Precise process control

Superior substrate surface processing

Comprehensive anti-contamination

Complete solutions




Specification

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  Applicable process



  No mura, water mark, rust, stain or damage


  Applicable substrate size


  100-micron level


  Applicable substrate thickness


  Micron level


  Applicable substrate thickness


  10ea


  Etching type


  Millimeter level

  Equipment type


  ±1° (within 60°)


  Process capability
  

  Complex-frequency ultrasonic wave in 4 bands, whose frequency can be freely switched

  Spherical wave ultrasonic technology without dead zone



Inquiry
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