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从G2.5到G8.6及以上尺寸ITO、IGZO、Ag、Mo、Al、Cu、Rework等各工艺类型湿制程刻蚀机设备的自主研发 Wet Etcher

Processes: A single substrate needs to be etched for more than 3 times, accounting for about 5% of all processes for panels
QTY of units: Demand only from front-end factory of AMOLED 30K ≥ 6 units/set

  • Wet Etcher

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High-precision and stable transmition

Precise process control

Superior substrate surface processing

Comprehensive anti-contamination

Complete solutions


Specification

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  Applicable process


ITO、IGZO、Ag、Mo、Al、Cu、Rework……


  Applicable substrate size


All sizes


  Applicable substrate thickness


≥0.3mm


  Etching type


Shower/Dip


  Equipment type


I type, U type, line type, customized

  Process capacity


Within Glass, Glass To Glass, Lot To Lot

No Mura, rolling marks, contamination, scratches

CD uniformity

CD loss

Low operating cost



Inquiry
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