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晶洲装备先后完成了从G2.5到G8.6及以上尺寸INC/UPC,DKC,DIC,BPC,ODF等各工艺类型清洗机设备的自主研发 Cleaner

Processes: A single substrate needs to be cleaned for more than 30 times, accounting for about 30% of all processes for panels
QTY of units: Demand only from front-end factory of AMOLED 30K ≥ 50 units/set

  • Cleaner


Details

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High-precision and stable transmition

Precise process control

Superior substrate surface processing

Comprehensive anti-contamination

Complete solutions




Specification

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  Applicable process


INC/UPC,DKC,DIC,BPC,ODF……


  Applicable substrate size


All sizes


  Applicable substrate thickness


≥0.3mm


  Cleaning method


UV/AP,DB/RB Brush,HP,BJ/SJ,HPMJ,MS,IR……


  Equipment type


I type, U type, line type, customized

  Process indicators


Contact angle

Particle removal rate

ESD control

No Mura, rolling marks, contamination, scratches

Low operating cost



Inquiry
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