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BSG Removal Equipment

Applicable process: TOPCon
Silicon wafer size: 182~230mm

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  • BSG Removal Equipment
  • BSG Removal Equipment
  • BSG Removal Equipment
  • BSG Removal Equipment
  • BSG Removal Equipment


Details

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· Applicable process: TOPCon


· Silicon wafer size: 182-230mm




Features

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High-speed, precision etching roller


Powered water film control


Multi-uniform flow channel


Multi-zone level control


Super wind knife





Specification

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Effective length of HF tank

QTY of lanes

Rated speed

Capacity of equipment

4.6m


182mm for 12 lanes

210mm for 10 lanes


5.5 m/min


182mm*182mm≥18000 pcs/h

182mm*210mm≥18000 pcs/h

(210mm side parallel to the rollers)

210mm*210mm≥15500 pcs/h




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