Applicable process: TOPCon, PERC
Silicon wafer size: 182~230mm
Home > Solutions > PV > TOPCON/PERC Solution
Applicable process: TOPCon, PERC
Silicon wafer size: 182~230mm
Details
 |  |  |
· Applicable process: TOPCon, PERC
· Silicon wafer size: 182-230mm
Features
|
|
|
|
|
High-speed, precision etching roller | Powered water film control | Multi-uniform flow channel | Multi-zone level control | Super wind knife |
Specification
Eff ective length of HF tank | QTY of lanes | Rated speed | Capacity of equipment |
2.0-2.3m | 182mm for 12 lanes 210mm for 10 lanes | 5.5 m/min | 182mm*182mm≥18000pcs/h 182mm*210mm≥18000pcs/h (210mm side parallel to the rollers) 210mm*210mm≥15500pcs/h |
FPD
PV
Semiconductor